We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Double-sided polishing device.
ipros is IPROS GMS IPROS One of the largest technical database sites in Japan that collects information on.

Double-sided polishing device - List of Manufacturers, Suppliers, Companies and Products

Double-sided polishing device Product List

1~2 item / All 2 items

Displayed results

Double-sided polishing system 'EJD-6BY'

Birth of a multifunctional compact CMP-compatible double-sided polishing device!

A compact and multifunctional CMP-compatible double-sided polishing device in size 6B has been developed from the "Trinity-Y" series. It is made with a full stainless steel dust cover and thoroughly uses corrosion-resistant materials throughout, making it suitable for all types of slurries and ideal for simultaneous double-sided polishing of difficult-to-machine materials. Additionally, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste.

  • Wafer processing/polishing equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

"Trinity-Y Series" EJD-6BY

It is suitable for all types of slurries and is ideal for simultaneous grinding of difficult-to-machine materials on both sides.

A compact and multifunctional CMP-compatible double-sided polishing device in size 6B has been developed from the "Trinity-Y" series. It is made using full stainless steel dust covers and thoroughly corrosion-resistant materials throughout, making it suitable for all types of slurries and ideal for simultaneous double-sided polishing of difficult-to-machine materials. Additionally, by combining it with other Trinity-Y devices, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste. 【Specifications】 ○ Polishing plate outer diameter φ386 × inner diameter φ148 mm ○ Plate rotation speed maximum 10–60 r.p.m. For more details, please contact us or download the catalog.

  • Wafer processing/polishing equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration